NXPLPC1768 MBed LPC1768 Development Board,40-pin DIP 54x26mm,  NXPLPC1768 by NXP Semiconductors / Freescale

NXPLPC1768 | NXP Semiconductors / Freescale MBed LPC1768 Development Board,40-pin DIP 54x26mm, NXPLPC1768

Brand: NXP Semiconductors / Freescale
MBed LPC1768 Development Board,40-pin DIP 54x26mm, NXPLPC1768
Stock: On request

Product Details

PDF Datasheet

Technical Docs

Description: MBed LPC1768 Development Board,40-pin DIP 54x26mm, NXPLPC1768

Technical Parameters

ApplicationGeneral Purpose
BrandNXP Semiconductors / Freescale
Data TierGeneral Description
Lead FreeYes
Mounting TypeSurface Mount
Operating Temperature-40 to +125 C
PackagingTape & Reel
Product TypeSemiconductor Component
RoHSCompliant
SeriesNXP
Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.
Datasheet not available online yet.
Can't find the datasheet you need? Contact our sourcing team and we'll help locate the official documentation from the manufacturer or our supply channels.
Request now →