NX30P0121UKZ Power Switch ICs - Power Distribution Back to Back output OVP for Qualcomm's platform by NXP Semiconductors / Freescale

NX30P0121UKZ | NXP Semiconductors / Freescale Power Switch ICs - Power Distribution Back to Back output OVP for Qualcomm's platform

Brand: NXP Semiconductors / Freescale
Power Switch ICs - Power Distribution Back to Back output OVP for Qualcomm's platform
Stock: On request

Product Details

PDF Datasheet

Technical Docs

Description: Power Switch ICs - Power Distribution Back to Back output OVP for Qualcomm's platform

Technical Parameters

ApplicationGeneral Purpose
BrandNXP Semiconductors / Freescale
Data TierGeneral Description
Lead FreeYes
Mounting TypeSurface Mount
Operating Temperature-40 to +125 C
PackagingTape & Reel
Product TypeSemiconductor Component
RoHSCompliant
SeriesNXP
Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.
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