MCF5307CAI66B IC MCU 32BIT ROMLESS 208FQFP by NXP USA Inc.

MCF5307CAI66B | NXP USA Inc. IC MCU 32BIT ROMLESS 208FQFP

Name: MCF5307CAI66B
Brand: NXP USA Inc.
SKU: MCF5307CAI66B

Category: General Purpose Semiconductors

Brand: NXP USA Inc.

IC MCU 32BIT ROMLESS 208FQFP

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Product Details

PDF Datasheet

Technical Docs

Description: IC MCU 32BIT ROMLESS 208FQFP

Technical Parameters

Application	General Purpose
Brand	NXP USA Inc.
Data Tier	General Description
Lead Free	Yes
Mounting Type	Surface Mount
Operating Temperature	-40 to +125 C
Packaging	Tape & Reel
Product Type	Semiconductor Component
RoHS	Compliant
Series	NXP

Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.

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PCB Footprint (.pcb)

3D Model (.stp)

Schematic Symbol (.sch)

DXF Drawing

MCF5307CAI66B Application and Selection Guide

MCF5307CAI66B Model and Manufacturer Information

MCF5307CAI66B, a General Purpose Semiconductors manufactured by NXP USA Inc.: MCF5307CAI66B helps you confirm the specific model, while NXP USA Inc. helps you confirm the product source. If you are selecting a part, you can first check whether MCF5307CAI66B meets your requirements, then check whether NXP USA Inc. matches your expectations, and then refer to IC MCU 32BIT ROMLESS 208FQFP for further evaluation.

MCF5307CAI66B Product Parameters and Description

The main parameters of NXP USA Inc.'s General Purpose Semiconductors product MCF5307CAI66B include IC MCU 32BIT ROMLESS 208FQFP. This is a General Purpose Semiconductors produced by NXP USA Inc., and it also offers good applicability in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices.

MCF5307CAI66B Application and Selection Reference

NXP USA Inc.'s General Purpose Semiconductors product MCF5307CAI66B has a relatively wide range of applications in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices. Overall, MCF5307CAI66B is a General Purpose Semiconductors solution worth considering, and manufacturer NXP USA Inc. provides long-term supply program support for this product, which helps ensure supply continuity during mass production.

Recommended Part Numbers for MCF5307CAI66B

Designers looking for MCF5307CAI66B recommended parts can evaluate the following options. MCF5307CAI66B selection decisions should verify parameters, tolerance and packaging against the original design bill of materials.

Recommended Part	Brand	Description
MPXM2202GS	NXP USA Inc.	SENS PRESSURE 29 PSI MAX MPAK
P1020NSN2DFB	NXP USA Inc.	IC MPU Q OR IQ 800MHZ 689TEBGA
MC9S12GC64MFUE	NXP USA Inc.	IC MCU 16BIT 64KB FLASH 80QFP

EZKEY can provide MCF5307CAI66B recommended part comparison data and engineering samples for evaluation.