What are the key features of GigaDevice Semiconductor (Beijing) Inc GD32F103RCT6?

This product belongs to the Memory category and ships in standard packaging. It features high reliability, stable performance and low power consumption. Key parameters include wide operating range, low loss, and over-temperature protection, suitable for industrial applications. Manufactured by GigaDevice Semiconductor (Beijing) Inc with full traceability.

What are the main application scenarios for GD32F103RCT6?

Typical applications include power management, industrial control. Additionally, it is widely used in automotive electronics, telecom infrastructure, medical devices, and consumer electronics as a critical circuit component, improving system integration and energy efficiency.

How does GD32F103RCT6 work?

This device follows established Memory design principles. Core functional stages include input handling, signal and power processing, and protection logic, ensuring stable operation under varying conditions. Refer to the datasheet for the detailed characteristics and application guidance.

What is the technical performance of GD32F103RCT6?

Performance highlights: stable characteristics across the operating temperature range, low loss, and long service life. Reliable contact and shock resistance, with protection against over-current and over-voltage where applicable. Meets industrial and automotive reliability standards where the series qualifies.

What is the current market demand for GD32F103RCT6?

The global Memory market is growing at ~6-8% CAGR, with particularly strong demand in power management. GigaDevice Semiconductor (Beijing) Inc GD32F103RCT6 is a mainstream model with stable stock and a typical lead time of 2-4 weeks. Driven by new energy and smart electronics trends, inquiries for this model are steadily increasing, indicating a positive long-term outlook.

What are the technical characteristics of GD32F103RCT6?

Three main technical features: 1) High reliability – stable performance over the rated life; 2) Low-loss design – reduced energy loss in operation; 3) Wide adaptability – compatible with various operating conditions. Additionally, GigaDevice Semiconductor (Beijing) Inc provides full technical support and reference designs.

GD32F103RCT6 ARM® Cortex®-M3 32-bit MCU, Max Speed (MHz): 108; Memory (Bytes) Flash: 256K; Memory (Bytes) SRAM: 48K; I/O: up to 51; Timer GPTM (16bit): 4; Timer Advanced TM (16bit): 2; Timer Basic TM (16bit): 2; Timer SysTick (24bit): 1; Timer WDG: 2; Timer RTC: 1; Connectivity I2C: 2; Connectivity SPI: 3; Connectivity USB 2 FS: 1; Connectivity I2S: 2; Analog Interface 12bit ADC Units (CHs): 3(16); Analog Interface 12bit DAC Units: 2; Package: LQFP64 by GigaDevice Semiconductor (Beijing) Inc

GD32F103RCT6 | GigaDevice Semiconductor (Beijing) Inc ARM® Cortex®-M3 32-bit MCU, Max Speed (MHz): 108; Memory (Bytes) Flash: 256K; Memory (Bytes) SRAM: 48K; I/O: up to 51; Timer GPTM (16bit): 4; Timer Advanced TM (16bit): 2; Timer Basic TM (16bit): 2; Timer SysTick (24bit): 1; Timer WDG: 2; Timer RTC: 1; Connectivity I2C: 2; Connectivity SPI: 3; Connectivity USB 2 FS: 1; Connectivity I2S: 2; Analog Interface 12bit ADC Units (CHs): 3(16); Analog Interface 12bit DAC Units: 2; Package: LQFP64

Category: Memory

Brand: GigaDevice Semiconductor (Beijing) Inc

ARM® Cortex®-M3 32-bit MCU, Max Speed (MHz): 108; Memory (Bytes) Flash: 256K; Memory (Bytes) SRAM: 48K; I/O: up to 51; Timer GPTM (16bit): 4; Timer Advanced TM (16bit): 2; Timer Basic TM (16bit): 2; Timer SysTick (24bit): 1; Timer WDG: 2; Timer RTC: 1; Connectivity I2C: 2; Connectivity SPI: 3; Connectivity USB 2 FS: 1; Connectivity I2S: 2; Analog Interface 12bit ADC Units (CHs): 3(16); Analog Interface 12bit DAC Units: 2; Package: LQFP64

Stock: On request

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Product Details

PDF Datasheet

Technical Docs

Description: ARM® Cortex®-M3 32-bit MCU, Max Speed (MHz): 108; Memory (Bytes) Flash: 256K; Memory (Bytes) SRAM: 48K; I/O: up to 51; Timer GPTM (16bit): 4; Timer Advanced TM (16bit): 2; Timer Basic TM (16bit): 2; Timer SysTick (24bit): 1; Timer WDG: 2; Timer RTC: 1; Connectivity I2C: 2; Connectivity SPI: 3; Connectivity USB 2 FS: 1; Connectivity I2S: 2; Analog Interface 12bit ADC Units (CHs): 3(16); Analog Interface 12bit DAC Units: 2; Package: LQFP64

Technical Parameters

Applications	General Purpose
Brand	GigaDevice
Data Tier	Family Level
Interface	SPI
Lead Free	Yes
Mounting Type	Surface Mount
Operating Temperature	-40 to +85 C
Package	SOP
Package / Case	SMD
Packaging	Tape & Reel
Product Type	Serial Flash Memory
RoHS	Compliant
Supply Voltage	3.3 V

Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.

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GD32F103RCT6 Application and Selection Guide

GD32F103RCT6 Model and Manufacturer Information

GD32F103RCT6, a Memory manufactured by GigaDevice: GD32F103RCT6 helps you confirm the specific model, while GigaDevice helps you confirm the product source. If you are selecting a part, you can first check whether GD32F103RCT6 meets your requirements, then check whether GigaDevice matches your expectations, and then refer to ARM® Cortex®-M3 32-bit MCU, Max Speed (MHz): 108; Memory (Bytes) Flash: 256K; Memory (Bytes) SRAM: 48K; I/O: up to 51; Timer GPTM (16bit): 4; Timer Advanced TM (16bit): 2; Timer Basic TM (16bit): 2; Timer SysTick (24bit): 1; Timer WDG: 2; Timer RTC: 1; Connectivity I2C: 2; Connectivity SPI: 3; Connectivity USB 2 FS: 1; Connectivity I2S: 2; Analog Interface 12bit ADC Units (CHs): 3(16); Analog Interface 12bit DAC Units: 2; Package: LQFP64 for further evaluation.

GD32F103RCT6 Product Parameters and Description

The main parameters of GigaDevice's Memory product GD32F103RCT6 include ARM® Cortex®-M3 32-bit MCU, Max Speed (MHz): 108; Memory (Bytes) Flash: 256K; Memory (Bytes) SRAM: 48K; I/O: up to 51; Timer GPTM (16bit): 4; Timer Advanced TM (16bit): 2; Timer Basic TM (16bit): 2; Timer SysTick (24bit): 1; Timer WDG: 2; Timer RTC: 1; Connectivity I2C: 2; Connectivity SPI: 3; Connectivity USB 2 FS: 1; Connectivity I2S: 2; Analog Interface 12bit ADC Units (CHs): 3(16); Analog Interface 12bit DAC Units: 2; Package: LQFP64. This is a Memory produced by GigaDevice, and it also offers good applicability in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices.

GD32F103RCT6 Application and Selection Reference

GigaDevice's Memory product GD32F103RCT6 has a relatively wide range of applications in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices. Overall, GD32F103RCT6 is a Memory solution worth considering, and manufacturer GigaDevice provides long-term supply program support for this product, which helps ensure supply continuity during mass production.

Recommended Part Numbers for GD32F103RCT6

Designers looking for GD32F103RCT6 recommended parts can evaluate the following options. GD32F103RCT6 selection decisions should verify parameters, tolerance and packaging against the original design bill of materials.

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EZKEY can provide GD32F103RCT6 recommended part comparison data and engineering samples for evaluation.