What are the key features of Infineon Technologies F3L500R12N3H7FB66BPSA1?

This product belongs to the IGBT Modules category and ships in standard packaging. It features high reliability, stable performance and low power consumption. Key parameters include wide operating range, low loss, and over-temperature protection, suitable for industrial applications. Manufactured by Infineon Technologies with full traceability.

What are the main application scenarios for F3L500R12N3H7FB66BPSA1?

Typical applications include power management, industrial control. Additionally, it is widely used in automotive electronics, telecom infrastructure, medical devices, and consumer electronics as a critical circuit component, improving system integration and energy efficiency.

How does F3L500R12N3H7FB66BPSA1 work?

This device follows established IGBT Modules design principles. Core functional stages include input handling, signal and power processing, and protection logic, ensuring stable operation under varying conditions. Refer to the datasheet for the detailed characteristics and application guidance.

What is the technical performance of F3L500R12N3H7FB66BPSA1?

Performance highlights: stable characteristics across the operating temperature range, low loss, and long service life. Reliable contact and shock resistance, with protection against over-current and over-voltage where applicable. Meets industrial and automotive reliability standards where the series qualifies.

What is the current market demand for F3L500R12N3H7FB66BPSA1?

The global IGBT Modules market is growing at ~6-8% CAGR, with particularly strong demand in power management. Infineon Technologies F3L500R12N3H7FB66BPSA1 is a mainstream model with stable stock and a typical lead time of 2-4 weeks. Driven by new energy and smart electronics trends, inquiries for this model are steadily increasing, indicating a positive long-term outlook.

What are the technical characteristics of F3L500R12N3H7FB66BPSA1?

Three main technical features: 1) High reliability – stable performance over the rated life; 2) Low-loss design – reduced energy loss in operation; 3) Wide adaptability – compatible with various operating conditions. Additionally, Infineon Technologies provides full technical support and reference designs.

F3L500R12N3H7FB66BPSA1 IGBT Modules EconoPACK 3 module with TRENCHSTOP IGBT7 and CoolSiC Schottky diode and NTC by Infineon Technologies

F3L500R12N3H7FB66BPSA1 | Infineon Technologies IGBT Modules EconoPACK 3 module with TRENCHSTOP IGBT7 and CoolSiC Schottky diode and NTC

Category: IGBT Modules

Brand: Infineon Technologies

IGBT Modules EconoPACK 3 module with TRENCHSTOP IGBT7 and CoolSiC Schottky diode and NTC

Stock: On request

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Product Details

PDF Datasheet

Technical Docs

Description: IGBT Modules EconoPACK 3 module with TRENCHSTOP IGBT7 and CoolSiC Schottky diode and NTC

Technical Parameters

Applications	General Purpose
Brand	Infineon
Category	IGBT Modules
Configuration	Single
Data Tier	Family Level
Description	IGBT Modules EconoPACK 3 module with TRENCHSTOP IGBT7 and CoolSiC Schottky diode and NTC
Lead Free	Yes
Manufacturer	Infineon Technologies
Mounting Type	Surface Mount
Number of Terminals	3
Operating Temperature	-55 to +175 C
Package	SOT-23
Package / Case	SMD / Through Hole
Packaging	Tray
Product Type	MOSFET / IGBT
RoHS	Compliant
Standard Pack Qty	10
Technology	N-Channel

Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.

📄 F3L500R12N3H7FB66BPSA1 Datasheet (PDF)

Source: https://cn.mouser.com/en/ProductDetail/Infineon-Technologies/F3L500R12N3H7FB66BPSA1?qs=lxPAlgZqN%2Fxjd%252BvEtZ5Q9A%3D%3D

PCB Footprint (.pcb)

3D Model (.stp)

Schematic Symbol (.sch)

DXF Drawing

F3L500R12N3H7FB66BPSA1 Application and Selection Guide

F3L500R12N3H7FB66BPSA1 Model and Manufacturer Information

F3L500R12N3H7FB66BPSA1, a IGBT Modules manufactured by Infineon: F3L500R12N3H7FB66BPSA1 helps you confirm the specific model, while Infineon helps you confirm the product source. If you are selecting a part, you can first check whether F3L500R12N3H7FB66BPSA1 meets your requirements, then check whether Infineon matches your expectations, and then refer to IGBT Modules EconoPACK 3 module with TRENCHSTOP IGBT7 and CoolSiC Schottky diode and NTC for further evaluation.

F3L500R12N3H7FB66BPSA1 Product Parameters and Description

The main parameters of Infineon's IGBT Modules product F3L500R12N3H7FB66BPSA1 include IGBT Modules EconoPACK 3 module with TRENCHSTOP IGBT7 and CoolSiC Schottky diode and NTC. This is a IGBT Modules produced by Infineon, and it also offers good applicability in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices.

F3L500R12N3H7FB66BPSA1 Application and Selection Reference

Infineon's IGBT Modules product F3L500R12N3H7FB66BPSA1 has a relatively wide range of applications in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices. Overall, F3L500R12N3H7FB66BPSA1 is a IGBT Modules solution worth considering, and manufacturer Infineon provides long-term supply program support for this product, which helps ensure supply continuity during mass production.

Recommended Part Numbers for F3L500R12N3H7FB66BPSA1

Designers looking for F3L500R12N3H7FB66BPSA1 recommended parts can evaluate the following options. F3L500R12N3H7FB66BPSA1 selection decisions should verify parameters, tolerance and packaging against the original design bill of materials.

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EZKEY can provide F3L500R12N3H7FB66BPSA1 recommended part comparison data and engineering samples for evaluation.