DF57-3P-1.2V(21) Application and Selection Guide
DF57-3P-1.2V(21) Model and Manufacturer Information
DF57-3P-1.2V(21), a Board to Board & Mezzanine Connectors manufactured by Hirose: DF57-3P-1.2V(21) helps you confirm the specific model, while Hirose helps you confirm the product source. If you are selecting a part, you can first check whether DF57-3P-1.2V(21) meets your requirements, then check whether Hirose matches your expectations, and then refer to CONN HEADER 1.2MM 3POS SMD for further evaluation.
DF57-3P-1.2V(21) Product Parameters and Description
The main parameters of Hirose's Board to Board & Mezzanine Connectors product DF57-3P-1.2V(21) include CONN HEADER 1.2MM 3POS SMD. This is a Board to Board & Mezzanine Connectors produced by Hirose, and it also offers good applicability in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices.
DF57-3P-1.2V(21) Application and Selection Reference
Hirose's Board to Board & Mezzanine Connectors product DF57-3P-1.2V(21) has a relatively wide range of applications in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices. Overall, DF57-3P-1.2V(21) is a Board to Board & Mezzanine Connectors solution worth considering, and manufacturer Hirose provides long-term supply program support for this product, which helps ensure supply continuity during mass production.
Recommended Part Numbers for DF57-3P-1.2V(21)
Designers looking for DF57-3P-1.2V(21) recommended parts can evaluate the following options. DF57-3P-1.2V(21) selection decisions should verify parameters, tolerance and packaging against the original design bill of materials.
| Recommended Part |
Brand |
Package |
Description |
| DF22-4P-7.92DS(05) |
Hirose Electric Co Ltd |
|
CONN HEADER 4POS 7.92MM R/A TIN |
| DF19G-20S-1C |
Hirose Electric Co Ltd |
|
CONN SOCKT CRIMP 20POS 1MM W/GRD |
| FH35C-37S-0.3SHW(50) |
Hirose Electric Co Ltd |
|
CONN FPC 37POS .3MM GOLD SMD |
EZKEY can provide DF57-3P-1.2V(21) recommended part comparison data and engineering samples for evaluation.