DF13-2630SCF Application and Selection Guide
DF13-2630SCF Model and Manufacturer Information
DF13-2630SCF, a Board to Board & Mezzanine Connectors manufactured by Hirose: DF13-2630SCF helps you confirm the specific model, while Hirose helps you confirm the product source. If you are selecting a part, you can first check whether DF13-2630SCF meets your requirements, then check whether Hirose matches your expectations, and then refer to CONN CONTACT 26-30AWG CRIMP TIN for further evaluation.
DF13-2630SCF Product Parameters and Description
The main parameters of Hirose's Board to Board & Mezzanine Connectors product DF13-2630SCF include CONN CONTACT 26-30AWG CRIMP TIN. This is a Board to Board & Mezzanine Connectors produced by Hirose, and it also offers good applicability in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices.
DF13-2630SCF Application and Selection Reference
Hirose's Board to Board & Mezzanine Connectors product DF13-2630SCF has a relatively wide range of applications in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices. Overall, DF13-2630SCF is a Board to Board & Mezzanine Connectors solution worth considering, and manufacturer Hirose provides long-term supply program support for this product, which helps ensure supply continuity during mass production.
Recommended Part Numbers for DF13-2630SCF
Designers looking for DF13-2630SCF recommended parts can evaluate the following options. DF13-2630SCF selection decisions should verify parameters, tolerance and packaging against the original design bill of materials.
| Recommended Part |
Brand |
Package |
Description |
| DF37NC-50DS-0.4V(53) |
Hirose Electric Co Ltd |
|
Board to Board & Mezzanine Connectors 50POS 0.4MM SMD GOLD CONN RCPT |
| DF36A-50S-0.4V(51) |
Hirose Electric Co Ltd |
|
CONN RCPT 0.4MM 50POS SMD |
| FX11LA-100S/10-SV(92) |
Hirose Electric Co Ltd |
|
CONN RECEPT 100POS W/POSTS SMD |
EZKEY can provide DF13-2630SCF recommended part comparison data and engineering samples for evaluation.