BSM50GP120 IGBT 模块 1200V 50A PIM by Infineon Technologies

BSM50GP120 | Infineon Technologies IGBT 模块 1200V 50A PIM

Category: IGBT Modules
Brand: Infineon Technologies
IGBT 模块 1200V 50A PIM
Stock: On request

Product Details

PDF Datasheet

Technical Docs

Description: IGBT 模块 1200V 50A PIM

Technical Parameters

ApplicationsGeneral Purpose
Collector Current (IC)50 A
Collector-Emitter Voltage (VCE)1200 V
Configuration6-pack / single / chopper
Data TierFamily Level
Device TypeIGBT Module
IsolationIsolated baseplate
Lead FreeYes
MountingThrough Hole
Mounting TypeScrew / Bolt-on
Operating Temperature-55°C ~ +150°C
Package / Case62mm / EconoPACK
PackagingTape & Reel
Product TypeDiscrete Semiconductor
RoHSCompliant
TechnologyTrench / Field Stop
Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.
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