BGM13S32F512GA-V3R 蓝牙模块 - 802.15.1 BGM13S Wireless Bluetooth Module, SiP, +19 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, Built-in Antenna by Silicon Labs

BGM13S32F512GA-V3R | Silicon Labs 蓝牙模块 - 802.15.1 BGM13S Wireless Bluetooth Module, SiP, +19 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, Built-in Antenna

Brand: Silicon Labs
蓝牙模块 - 802.15.1 BGM13S Wireless Bluetooth Module, SiP, +19 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, Built-in Antenna
Stock: On request

Product Details

PDF Datasheet

Technical Docs

Description: 蓝牙模块 - 802.15.1 BGM13S Wireless Bluetooth Module, SiP, +19 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, Built-in Antenna

Technical Parameters

ApplicationsGeneral Purpose
BrandSilicon Labs
Data TierFamily Level
Device TypeBluetooth Low Energy Module
FeatureStandard
Flash512 KB
Frequency2.4 GHz ISM Band
Lead FreeYes
MCUEFR32 Series
Mounting TypeSMD
Operating Temperature-40°C ~ +85°C
PackagingTape & Reel
Product TypeMicrocontroller (MCU)
ProtocolBLE 5.x
RoHSCompliant
RoHS CompliantYes
Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.
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