BCM63168VKFEBG IC,CPU,FCBGA-21*21mm by Broadcom Corporation

BCM63168VKFEBG | Broadcom Corporation IC,CPU,FCBGA-21*21mm

Brand: Broadcom Corporation
IC,CPU,FCBGA-21*21mm
Stock: On request

Product Details

PDF Datasheet

Technical Docs

Description: IC,CPU,FCBGA-21*21mm

Technical Parameters

ApplicationResidential Gateway / ONT
Data TierFamily Level
Device TypeDSL / PON Gateway SoC
InterfacesGbE, USB, PCIe, NAND/NOR
Lead FreeYes
Mounting StyleSurface Mount
Mounting TypeSurface Mount
Operating Temperature-40 to +85°C
Package TypeBGA
PackagingTape & Reel
Product TypeIntegrated Circuit
RoHSCompliant
RoHS StatusRoHS Compliant
StandardG.fast / VDSL2 / GPON / XG-PON
Voice SupportVoIP / DECT
Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.
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