BCM605040-57N by TDK Corporation

BCM605040-57N | TDK Corporation

Brand: TDK Corporation
Stock: On request

Product Details

PDF Datasheet

Technical Docs

Description:

Technical Parameters

ApplicationNetworking / Broadband / IoT
ApplicationsGeneral Purpose
Data TierFamily Level
Device TypeBroadband / Networking SoC
FeaturesGeneral Purpose
InterfacesEthernet, USB, PCIe, I2C, SPI, UART
Lead FreeYes
Mounting StyleSurface Mount
Mounting TypeSurface Mount
Operating Temperature-40 to +85°C
Package TypeBGA
PackagingTape & Reel
Product TypeIntegrated Circuit
RoHSCompliant
RoHS StatusRoHS Compliant
Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.
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