BCM55040BB1IFSBG RF System on a Chip - SoC 10G xPON Bridge Chip by Avago Technologies (Broadcom Limited)

BCM55040BB1IFSBG | Avago Technologies (Broadcom Limited) RF System on a Chip - SoC 10G xPON Bridge Chip

Name: BCM55040BB1IFSBG
Brand: Avago Technologies (Broadcom Limited)
SKU: BCM55040BB1IFSBG

Category: Telecom Interface ICs

Brand: Avago Technologies (Broadcom Limited)

RF System on a Chip - SoC 10G xPON Bridge Chip

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Product Details

PDF Datasheet

Technical Docs

Description: RF System on a Chip - SoC 10G xPON Bridge Chip

Technical Parameters

Application	Network Switch / Router
Auto Mdix	Yes
Data Tier	Family Level
Device Type	Ethernet Switch / PHY
Interfaces	RGMII, SGMII
Lead Free	Yes
Mounting Style	Surface Mount
Mounting Type	Surface Mount
Operating Temperature	-40 to +85°C
Package Type	BGA
Packaging	Tape & Reel
Power Over Ethernet	PoE PD Support
RoHS Status	RoHS Compliant
Standard	10/100/1000BASE-T

Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.

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PCB Footprint (.pcb)

3D Model (.stp)

Schematic Symbol (.sch)

DXF Drawing

BCM55040BB1IFSBG Application and Selection Guide

BCM55040BB1IFSBG Model and Manufacturer Information

BCM55040BB1IFSBG, a Telecom Interface ICs manufactured by Avago Technologies (Broadcom Limited): BCM55040BB1IFSBG helps you confirm the specific model, while Avago Technologies (Broadcom Limited) helps you confirm the product source. If you are selecting a part, you can first check whether BCM55040BB1IFSBG meets your requirements, then check whether Avago Technologies (Broadcom Limited) matches your expectations, and then refer to RF System on a Chip - SoC 10G xPON Bridge Chip for further evaluation.

BCM55040BB1IFSBG Product Parameters and Description

The main parameters of Avago Technologies (Broadcom Limited)'s Telecom Interface ICs product BCM55040BB1IFSBG include RF System on a Chip - SoC 10G xPON Bridge Chip. This is a Telecom Interface ICs produced by Avago Technologies (Broadcom Limited), and it also offers good applicability in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices.

BCM55040BB1IFSBG Application and Selection Reference

Avago Technologies (Broadcom Limited)'s Telecom Interface ICs product BCM55040BB1IFSBG has a relatively wide range of applications in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices. Overall, BCM55040BB1IFSBG is a Telecom Interface ICs solution worth considering, and manufacturer Avago Technologies (Broadcom Limited) provides long-term supply program support for this product, which helps ensure supply continuity during mass production.

Recommended Part Numbers for BCM55040BB1IFSBG

Designers looking for BCM55040BB1IFSBG recommended parts can evaluate the following options. BCM55040BB1IFSBG selection decisions should verify parameters, tolerance and packaging against the original design bill of materials.

Recommended Part	Brand	Description
BCM82759A0IFSBG	Avago Technologies (Broadcom Limited)	Broadcom Limited
BCM54618EB1KMLG	Avago Technologies (Broadcom Limited)	LIN 收发器 Single Gigabit Phy
BCM82780FA3KFSBG	Avago Technologies (Broadcom Limited)	NA

EZKEY can provide BCM55040BB1IFSBG recommended part comparison data and engineering samples for evaluation.