B39262B8366L210 -- by RF360 - A Qualcomm-TDK joint venture

B39262B8366L210 | RF360 - A Qualcomm-TDK joint venture --

Name: B39262B8366L210
Brand: RF360 - A Qualcomm-TDK joint venture
SKU: B39262B8366L210

Category: RF Modules

Brand: RF360 - A Qualcomm-TDK joint venture

Stock: On request

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Product Details

PDF Datasheet

Technical Docs

Description: --

Technical Parameters

Application	Cellular / RF front-end filtering
Component Type	SAW / BAW RF filter / duplexer
Data Tier	Family Level
Impedance	50 Ω
Lead Free	RoHS compliant
Mounting Style	SMD
Operating Temperature	-30 °C to +85 °C
Package	SMD ceramic / laminate
Part Family	TDK / RF360 B39xxx
Technology	SAW or BAW (FBAR)

Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.

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PCB Footprint (.pcb)

3D Model (.stp)

Schematic Symbol (.sch)

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B39262B8366L210 Application and Selection Guide

B39262B8366L210 Model and Manufacturer Information

B39262B8366L210, a RF Modules manufactured by RF360 - A Qualcomm-TDK joint venture: B39262B8366L210 helps you confirm the specific model, while RF360 - A Qualcomm-TDK joint venture helps you confirm the product source. If you are selecting a part, you can first check whether B39262B8366L210 meets your requirements, then check whether RF360 - A Qualcomm-TDK joint venture matches your expectations, and then refer to -- for further evaluation.

B39262B8366L210 Product Parameters and Description

The main parameters of RF360 - A Qualcomm-TDK joint venture's RF Modules product B39262B8366L210 include --. This is a RF Modules produced by RF360 - A Qualcomm-TDK joint venture, and it also offers good applicability in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices.

B39262B8366L210 Application and Selection Reference

RF360 - A Qualcomm-TDK joint venture's RF Modules product B39262B8366L210 has a relatively wide range of applications in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices. Overall, B39262B8366L210 is a RF Modules solution worth considering, and manufacturer RF360 - A Qualcomm-TDK joint venture provides long-term supply program support for this product, which helps ensure supply continuity during mass production.

Recommended Part Numbers for B39262B8366L210

Designers looking for B39262B8366L210 recommended parts can evaluate the following options. B39262B8366L210 selection decisions should verify parameters, tolerance and packaging against the original design bill of materials.

Recommended Part	Brand	Description
B39781B8369P810W05	RF360 - A Qualcomm-TDK joint venture	AN6678A,AN7202A,AN7590A,QN6887A,QN7026A,QN7500A,SL9651B,ST7126B
B39781B8370P810	RF360 - A Qualcomm-TDK joint venture	(XM)接收滤波器(RX_SAW-BAW_FILTER)_B20+B28_单端
B39741B1272L210	RF360 - A Qualcomm-TDK joint venture	FILTER,SAW,LTE/5G B12,707.5/737.5MHz;30dBm,1.61.20.6mm,B39741B1272L210,HF,RF360

EZKEY can provide B39262B8366L210 recommended part comparison data and engineering samples for evaluation.