What are the key features of Alliance Memory Inc ASFC8G31MB-51BIN?

This product belongs to the eMMC category and ships in standard packaging. It features high reliability, stable performance and low power consumption. Key parameters include wide operating range, low loss, and over-temperature protection, suitable for industrial applications. Manufactured by Alliance Memory Inc with full traceability.

What are the main application scenarios for ASFC8G31MB-51BIN?

Typical applications include power management, industrial control. Additionally, it is widely used in automotive electronics, telecom infrastructure, medical devices, and consumer electronics as a critical circuit component, improving system integration and energy efficiency.

How does ASFC8G31MB-51BIN work?

This device follows established eMMC design principles. Core functional stages include input handling, signal and power processing, and protection logic, ensuring stable operation under varying conditions. Refer to the datasheet for the detailed characteristics and application guidance.

What is the technical performance of ASFC8G31MB-51BIN?

Performance highlights: stable characteristics across the operating temperature range, low loss, and long service life. Reliable contact and shock resistance, with protection against over-current and over-voltage where applicable. Meets industrial and automotive reliability standards where the series qualifies.

What is the current market demand for ASFC8G31MB-51BIN?

The global eMMC market is growing at ~6-8% CAGR, with particularly strong demand in power management. Alliance Memory Inc ASFC8G31MB-51BIN is a mainstream model with stable stock and a typical lead time of 2-4 weeks. Driven by new energy and smart electronics trends, inquiries for this model are steadily increasing, indicating a positive long-term outlook.

What are the technical characteristics of ASFC8G31MB-51BIN?

Three main technical features: 1) High reliability – stable performance over the rated life; 2) Low-loss design – reduced energy loss in operation; 3) Wide adaptability – compatible with various operating conditions. Additionally, Alliance Memory Inc provides full technical support and reference designs.

ASFC8G31MB-51BIN eMMC eMMC, 8GB MLC 153 ball, industrial temp, 5.1, 3V, 153ball FBGA Package (11.5x13mm), B Die by Alliance Memory Inc

ASFC8G31MB-51BIN | Alliance Memory Inc eMMC eMMC, 8GB MLC 153 ball, industrial temp, 5.1, 3V, 153ball FBGA Package (11.5x13mm), B Die

Category: eMMC

Brand: Alliance Memory Inc

eMMC eMMC, 8GB MLC 153 ball, industrial temp, 5.1, 3V, 153ball FBGA Package (11.5x13mm), B Die

Stock: On request

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Product Details

PDF Datasheet

Technical Docs

Description: eMMC eMMC, 8GB MLC 153 ball, industrial temp, 5.1, 3V, 153ball FBGA Package (11.5x13mm), B Die

Technical Parameters

Brand	Alliance Memory Inc
Category	eMMC
Data Tier	Family Level
Description	eMMC eMMC, 8GB MLC 153 ball, industrial temp, 5.1, 3V, 153ball FBGA Package (11.5x13mm), B Die
Manufacturer	Alliance Memory
Operating Temperature	-40 to +85 C
Packaging	Tray
Product Type	Memory (SRAM/DRAM)
RoHS	Compliant
Standard Pack Qty	152

Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.

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PCB Footprint (.pcb)

3D Model (.stp)

Schematic Symbol (.sch)

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ASFC8G31MB-51BIN Application and Selection Guide

ASFC8G31MB-51BIN Model and Manufacturer Information

ASFC8G31MB-51BIN, a eMMC manufactured by Alliance Memory Inc: ASFC8G31MB-51BIN helps you confirm the specific model, while Alliance Memory Inc helps you confirm the product source. If you are selecting a part, you can first check whether ASFC8G31MB-51BIN meets your requirements, then check whether Alliance Memory Inc matches your expectations, and then refer to eMMC eMMC, 8GB MLC 153 ball, industrial temp, 5.1, 3V, 153ball FBGA Package (11.5x13mm), B Die for further evaluation.

ASFC8G31MB-51BIN Product Parameters and Description

The main parameters of Alliance Memory Inc's eMMC product ASFC8G31MB-51BIN include eMMC eMMC, 8GB MLC 153 ball, industrial temp, 5.1, 3V, 153ball FBGA Package (11.5x13mm), B Die. This is a eMMC produced by Alliance Memory Inc, and it also offers good applicability in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices.

ASFC8G31MB-51BIN Application and Selection Reference

Alliance Memory Inc's eMMC product ASFC8G31MB-51BIN has a relatively wide range of applications in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices. Overall, ASFC8G31MB-51BIN is a eMMC solution worth considering, and manufacturer Alliance Memory Inc provides long-term supply program support for this product, which helps ensure supply continuity during mass production.

Recommended Part Numbers for ASFC8G31MB-51BIN

Designers looking for ASFC8G31MB-51BIN recommended parts can evaluate the following options. ASFC8G31MB-51BIN selection decisions should verify parameters, tolerance and packaging against the original design bill of materials.

Recommended Part	Brand	Description
AS4C16M16SB-7TCN	Alliance Memory Inc	DRAM SDRAM, 256M, 16M x 16, 3.3V, 54pin TSOP II, 143Mhz, Commerical Temp - Tray
AS4C256M16D3LC-12BAN	Alliance Memory Inc
AS4C512M16D3LB-12BCN	Alliance Memory Inc	DRAM DDR3L, 8G, 512M X 16, 1.35V, 96-BALL FBGA, 800MHZ COMMERCIAL TEMP (MT41K512M16HA-125:A)

EZKEY can provide ASFC8G31MB-51BIN recommended part comparison data and engineering samples for evaluation.