What are the key features of Alliance Memory ASFC32G31T3-51BIN?

This product belongs to the eMMC category and ships in standard packaging. It features high reliability, stable performance and low power consumption. Key parameters include wide operating range, low loss, and over-temperature protection, suitable for industrial applications. Manufactured by Alliance Memory with full traceability.

What are the main application scenarios for ASFC32G31T3-51BIN?

Typical applications include power management, industrial control. Additionally, it is widely used in automotive electronics, telecom infrastructure, medical devices, and consumer electronics as a critical circuit component, improving system integration and energy efficiency.

How does ASFC32G31T3-51BIN work?

This device follows established eMMC design principles. Core functional stages include input handling, signal and power processing, and protection logic, ensuring stable operation under varying conditions. Refer to the datasheet for the detailed characteristics and application guidance.

What is the technical performance of ASFC32G31T3-51BIN?

Performance highlights: stable characteristics across the operating temperature range, low loss, and long service life. Reliable contact and shock resistance, with protection against over-current and over-voltage where applicable. Meets industrial and automotive reliability standards where the series qualifies.

What is the current market demand for ASFC32G31T3-51BIN?

The global eMMC market is growing at ~6-8% CAGR, with particularly strong demand in power management. Alliance Memory ASFC32G31T3-51BIN is a mainstream model with stable stock and a typical lead time of 2-4 weeks. Driven by new energy and smart electronics trends, inquiries for this model are steadily increasing, indicating a positive long-term outlook.

What are the technical characteristics of ASFC32G31T3-51BIN?

Three main technical features: 1) High reliability – stable performance over the rated life; 2) Low-loss design – reduced energy loss in operation; 3) Wide adaptability – compatible with various operating conditions. Additionally, Alliance Memory provides full technical support and reference designs.

ASFC32G31T3-51BIN eMMC eMMC 32GB, 3V, (TLC Gen3 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Tray by Alliance Memory

ASFC32G31T3-51BIN | Alliance Memory eMMC eMMC 32GB, 3V, (TLC Gen3 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Tray

Name: ASFC32G31T3-51BIN
Brand: Alliance Memory
SKU: ASFC32G31T3-51BIN
Price: 83.38 USD
Availability: InStock

Category: eMMC

Brand: Alliance Memory

eMMC eMMC 32GB, 3V, (TLC Gen3 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Tray

Quantity: 1,520 pcs

Unit Price: USD 83.38

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Product Details

PDF Datasheet

Technical Docs

Description: eMMC eMMC 32GB, 3V, (TLC Gen3 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Tray

Technical Parameters

Brand	Alliance Memory
Category	eMMC
Data Tier	Family Level
Description	eMMC eMMC 32GB, 3V, (TLC Gen3 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Tray
Manufacturer	Alliance Memory
Operating Temperature	-40 to +85 C
Packaging	Tray
Product Type	Memory (SRAM/DRAM)
RoHS	Compliant
Standard Pack Qty	152

Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.

📄 ASFC32G31T3-51BIN Datasheet (PDF)

Source: https://cn.mouser.com/en/ProductDetail/Alliance-Memory/ASFC32G31T3-51BIN?qs=P%2FxahI%252BVehkV9mYTpuZF0Q%3D%3D

PCB Footprint (.pcb)

3D Model (.stp)

Schematic Symbol (.sch)

DXF Drawing

ASFC32G31T3-51BIN Application and Selection Guide

ASFC32G31T3-51BIN Model and Manufacturer Information

ASFC32G31T3-51BIN, a eMMC manufactured by Alliance Memory: ASFC32G31T3-51BIN helps you confirm the specific model, while Alliance Memory helps you confirm the product source. If you are selecting a part, you can first check whether ASFC32G31T3-51BIN meets your requirements, then check whether Alliance Memory matches your expectations, and then refer to eMMC eMMC 32GB, 3V, (TLC Gen3 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Tray for further evaluation.

ASFC32G31T3-51BIN Product Parameters and Description

The main parameters of Alliance Memory's eMMC product ASFC32G31T3-51BIN include eMMC eMMC 32GB, 3V, (TLC Gen3 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Tray. This is a eMMC produced by Alliance Memory, and it also offers good applicability in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices.

ASFC32G31T3-51BIN Application and Selection Reference

Alliance Memory's eMMC product ASFC32G31T3-51BIN has a relatively wide range of applications in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices. Overall, ASFC32G31T3-51BIN is a eMMC solution worth considering, and manufacturer Alliance Memory provides long-term supply program support for this product, which helps ensure supply continuity during mass production.

Recommended Part Numbers for ASFC32G31T3-51BIN

Designers looking for ASFC32G31T3-51BIN recommended parts can evaluate the following options. ASFC32G31T3-51BIN selection decisions should verify parameters, tolerance and packaging against the original design bill of materials.

Recommended Part	Brand	Description
AS6C1008-55SINTR	ALLIANCE MEMORY	静态随机存取存储器 1Mb, 2.7V-5.5V, 55ns 128K x 8 Asynch 静态随机存取存储器
AS6C1008-55STIN	ALLIANCE MEMORY	AS6C1008 Series 1-Mbit (128 K x 8) 3 V 55 ns CMOS Static RAM - TSOP-32
ASFC16G31TA-51BCN	Alliance Memory	eMMC 16GB, eMMC 5.1, 3V, Rev.A, Commercial Grade, 153ball FBGA Package (11.5x13mm)

EZKEY can provide ASFC32G31T3-51BIN recommended part comparison data and engineering samples for evaluation.