ASFC32G31T3-51BIN eMMC eMMC 32GB, 3V, (TLC Gen3 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Tray by Alliance Memory

ASFC32G31T3-51BIN | Alliance Memory eMMC eMMC 32GB, 3V, (TLC Gen3 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Tray

Name: ASFC32G31T3-51BIN
Brand: Alliance Memory
SKU: ASFC32G31T3-51BIN
Price: 97.75 USD
Availability: InStock

Category: eMMC

Brand: Alliance Memory

eMMC eMMC 32GB, 3V, (TLC Gen3 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Tray

Quantity: 1,520 pcs

Unit Price: USD 97.75

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Product Details

PDF Datasheet

Technical Docs

Description: eMMC eMMC 32GB, 3V, (TLC Gen3 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Tray

Technical Parameters

Brand	Alliance Memory
Category	eMMC
Data Tier	Family Level
Description	eMMC eMMC 32GB, 3V, (TLC Gen3 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Tray
Manufacturer	Alliance Memory
Operating Temperature	-40 to +85 C
Packaging	Tray
Product Type	Memory (SRAM/DRAM)
RoHS	Compliant
Standard Pack Qty	152

Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.

📄 ASFC32G31T3-51BIN Datasheet (PDF)

Source: https://cn.mouser.com/en/ProductDetail/Alliance-Memory/ASFC32G31T3-51BIN?qs=P%2FxahI%252BVehkV9mYTpuZF0Q%3D%3D

PCB Footprint (.pcb)

3D Model (.stp)

Schematic Symbol (.sch)

DXF Drawing

ASFC32G31T3-51BIN Application and Selection Guide

ASFC32G31T3-51BIN Model and Manufacturer Information

ASFC32G31T3-51BIN, a eMMC manufactured by Alliance Memory: ASFC32G31T3-51BIN helps you confirm the specific model, while Alliance Memory helps you confirm the product source. If you are selecting a part, you can first check whether ASFC32G31T3-51BIN meets your requirements, then check whether Alliance Memory matches your expectations, and then refer to eMMC eMMC 32GB, 3V, (TLC Gen3 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Tray for further evaluation.

ASFC32G31T3-51BIN Product Parameters and Description

The main parameters of Alliance Memory's eMMC product ASFC32G31T3-51BIN include eMMC eMMC 32GB, 3V, (TLC Gen3 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Tray. This is a eMMC produced by Alliance Memory, and it also offers good applicability in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices.

ASFC32G31T3-51BIN Application and Selection Reference

Alliance Memory's eMMC product ASFC32G31T3-51BIN has a relatively wide range of applications in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices. Overall, ASFC32G31T3-51BIN is a eMMC solution worth considering, and manufacturer Alliance Memory provides long-term supply program support for this product, which helps ensure supply continuity during mass production.

Recommended Part Numbers for ASFC32G31T3-51BIN

Designers looking for ASFC32G31T3-51BIN recommended parts can evaluate the following options. ASFC32G31T3-51BIN selection decisions should verify parameters, tolerance and packaging against the original design bill of materials.

Recommended Part	Brand	Package	Description
AS4C256M16D3LC-12BCN	Alliance Memory
AS4C4M16S-6TIN	ALLIANCE MEMORY
AS4C64M16D3LB-12BINTR	Alliance Memory

EZKEY can provide ASFC32G31T3-51BIN recommended part comparison data and engineering samples for evaluation.