55487-0219 Application and Selection Guide
55487-0219 Model and Manufacturer Information
55487-0219, a Headers & Wire Housings manufactured by Molex: 55487-0219 helps you confirm the specific model, while Molex helps you confirm the product source. If you are selecting a part, you can first check whether 55487-0219 meets your requirements, then check whether Molex matches your expectations, and then refer to Headers & Wire Housings 2mm Pit. MicroTPA Wire-to-Board Header, Vert., High Wall Type, Kinked PC Tail, w/ Inner Positive Lock, 2 Pos., Natural for further evaluation.
55487-0219 Product Parameters and Description
The main parameters of Molex's Headers & Wire Housings product 55487-0219 include Headers & Wire Housings 2mm Pit. MicroTPA Wire-to-Board Header, Vert., High Wall Type, Kinked PC Tail, w/ Inner Positive Lock, 2 Pos., Natural. This is a Headers & Wire Housings produced by Molex, and it also offers good applicability in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices.
55487-0219 Application and Selection Reference
Molex's Headers & Wire Housings product 55487-0219 has a relatively wide range of applications in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices. Overall, 55487-0219 is a Headers & Wire Housings solution worth considering, and manufacturer Molex provides long-term supply program support for this product, which helps ensure supply continuity during mass production.
Recommended Part Numbers for 55487-0219
Designers looking for 55487-0219 recommended parts can evaluate the following options. 55487-0219 selection decisions should verify parameters, tolerance and packaging against the original design bill of materials.
| Recommended Part |
Brand |
Package |
Description |
| 74737-0016 |
molex |
|
I/O Connectors SFP 1X1 CAGE PRESS-FIT PCI |
| 505473-1010 |
Molex |
|
4P6S, 2, 0.4MM RoHS: Compliant Min Qty: 1 |
| 5018761820 |
Molex |
|
null |
EZKEY can provide 55487-0219 recommended part comparison data and engineering samples for evaluation.