What are the key features of Molex, LLC 53313-1665?

This product belongs to the Headers & Wire Housings category and ships in standard packaging. It features high reliability, stable performance and low power consumption. Key parameters include wide operating range, low loss, and over-temperature protection, suitable for industrial applications. Manufactured by Molex, LLC with full traceability.

What are the main application scenarios for 53313-1665?

Typical applications include power management, industrial control. Additionally, it is widely used in automotive electronics, telecom infrastructure, medical devices, and consumer electronics as a critical circuit component, improving system integration and energy efficiency.

How does 53313-1665 work?

This device follows established Headers & Wire Housings design principles. Core functional stages include input handling, signal and power processing, and protection logic, ensuring stable operation under varying conditions. Refer to the datasheet for the detailed characteristics and application guidance.

What is the technical performance of 53313-1665?

Performance highlights: stable characteristics across the operating temperature range, low loss, and long service life. Reliable contact and shock resistance, with protection against over-current and over-voltage where applicable. Meets industrial and automotive reliability standards where the series qualifies.

What is the current market demand for 53313-1665?

The global Headers & Wire Housings market is growing at ~6-8% CAGR, with particularly strong demand in power management. Molex, LLC 53313-1665 is a mainstream model with stable stock and a typical lead time of 2-4 weeks. Driven by new energy and smart electronics trends, inquiries for this model are steadily increasing, indicating a positive long-term outlook.

What are the technical characteristics of 53313-1665?

Three main technical features: 1) High reliability – stable performance over the rated life; 2) Low-loss design – reduced energy loss in operation; 3) Wide adaptability – compatible with various operating conditions. Additionally, Molex, LLC provides full technical support and reference designs.

53313-1665 Headers & Wire Housings 2.0 WtB Str Dual-Row WaferAssy 16Ckt Gra by Molex, LLC

53313-1665 | Molex, LLC Headers & Wire Housings 2.0 WtB Str Dual-Row WaferAssy 16Ckt Gra

Category: Headers & Wire Housings

Brand: Molex, LLC

Headers & Wire Housings 2.0 WtB Str Dual-Row WaferAssy 16Ckt Gra

Stock: On request

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Product Details

PDF Datasheet

Technical Docs

Description: Headers & Wire Housings 2.0 WtB Str Dual-Row WaferAssy 16Ckt Gra

Technical Parameters

Category	Headers & Wire Housings
Contact Finish	Tin / Gold
Contact Material	Copper Alloy
Data Tier	Family Level
Description	Headers & Wire Housings 2.0 WtB Str Dual-Row WaferAssy 16Ckt Gra
Flammability Rating	UL94V-0
Insulation Material	Thermoplastic / Nylon
Manufacturer	Molex
Mounting Type	Through Hole / SMD
Operating Temperature	-40 to +105 C
Product Type	Wire-to-Board / Board-to-Board Connector
RoHS	Compliant
Series	Molex Connector
Standard Pack Qty	840

Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.

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3D Model (.stp)

Schematic Symbol (.sch)

DXF Drawing

53313-1665 Application and Selection Guide

53313-1665 Model and Manufacturer Information

53313-1665, a Headers & Wire Housings manufactured by Molex: 53313-1665 helps you confirm the specific model, while Molex helps you confirm the product source. If you are selecting a part, you can first check whether 53313-1665 meets your requirements, then check whether Molex matches your expectations, and then refer to Headers & Wire Housings 2.0 WtB Str Dual-Row WaferAssy 16Ckt Gra for further evaluation.

53313-1665 Product Parameters and Description

The main parameters of Molex's Headers & Wire Housings product 53313-1665 include Headers & Wire Housings 2.0 WtB Str Dual-Row WaferAssy 16Ckt Gra. This is a Headers & Wire Housings produced by Molex, and it also offers good applicability in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices.

53313-1665 Application and Selection Reference

Molex's Headers & Wire Housings product 53313-1665 has a relatively wide range of applications in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices. Overall, 53313-1665 is a Headers & Wire Housings solution worth considering, and manufacturer Molex provides long-term supply program support for this product, which helps ensure supply continuity during mass production.

Recommended Part Numbers for 53313-1665

Designers looking for 53313-1665 recommended parts can evaluate the following options. 53313-1665 selection decisions should verify parameters, tolerance and packaging against the original design bill of materials.

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EZKEY can provide 53313-1665 recommended part comparison data and engineering samples for evaluation.