530002B02500G Application and Selection Guide
530002B02500G Model and Manufacturer Information
530002B02500G, a Discrete Semiconductors manufactured by ON Semiconductor: 530002B02500G helps you confirm the specific model, while ON Semiconductor helps you confirm the product source. If you are selecting a part, you can first check whether 530002B02500G meets your requirements, then check whether ON Semiconductor matches your expectations, and then refer to HEATSINK TO-220 POWER W/PINS BK for further evaluation.
530002B02500G Product Parameters and Description
The main parameters of ON Semiconductor's Discrete Semiconductors product 530002B02500G include HEATSINK TO-220 POWER W/PINS BK. This is a Discrete Semiconductors produced by ON Semiconductor, and it also offers good applicability in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices.
530002B02500G Application and Selection Reference
ON Semiconductor's Discrete Semiconductors product 530002B02500G has a relatively wide range of applications in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices. Overall, 530002B02500G is a Discrete Semiconductors solution worth considering, and manufacturer ON Semiconductor provides long-term supply program support for this product, which helps ensure supply continuity during mass production.
Recommended Part Numbers for 530002B02500G
Designers looking for 530002B02500G recommended parts can evaluate the following options. 530002B02500G selection decisions should verify parameters, tolerance and packaging against the original design bill of materials.
| Recommended Part |
Brand |
Package |
Description |
| 4170G |
Aavid, Thermal Division of Boyd Corporation |
|
THERM PAD 19.3MMX13.97MM |
| 374024B00035G |
Aavid, Thermal Division of Boyd Corporation |
|
HEATSINK BGA 23X23X10MM W/ADH |
| 43-77-9G |
Aavid, Thermal Division of Boyd Corporation |
|
THERM PAD 18.42MMX13.21MM AMBER |
EZKEY can provide 530002B02500G recommended part comparison data and engineering samples for evaluation.