374324B00035G Application and Selection Guide
374324B00035G Model and Manufacturer Information
374324B00035G, a Discrete Semiconductors manufactured by ON Semiconductor: 374324B00035G helps you confirm the specific model, while ON Semiconductor helps you confirm the product source. If you are selecting a part, you can first check whether 374324B00035G meets your requirements, then check whether ON Semiconductor matches your expectations, and then refer to HEATSINK BGA W/ADHESIVE TAPE for further evaluation.
374324B00035G Product Parameters and Description
The main parameters of ON Semiconductor's Discrete Semiconductors product 374324B00035G include HEATSINK BGA W/ADHESIVE TAPE. This is a Discrete Semiconductors produced by ON Semiconductor, and it also offers good applicability in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices.
374324B00035G Application and Selection Reference
ON Semiconductor's Discrete Semiconductors product 374324B00035G has a relatively wide range of applications in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices. Overall, 374324B00035G is a Discrete Semiconductors solution worth considering, and manufacturer ON Semiconductor provides long-term supply program support for this product, which helps ensure supply continuity during mass production.
Recommended Part Numbers for 374324B00035G
Designers looking for 374324B00035G recommended parts can evaluate the following options. 374324B00035G selection decisions should verify parameters, tolerance and packaging against the original design bill of materials.
| Recommended Part |
Brand |
Package |
Description |
| 43-77-20G |
Aavid, Thermal Division of Boyd Corporation |
|
THERM PAD 23.24MMX18.8MM AMBER |
| 542502D00000G |
Aavid, Thermal Division of Boyd Corporation |
|
HEATSINK TO-220 TAB TIN |
| 530002B02500G |
Aavid, Thermal Division of Boyd Corporation |
|
HEATSINK TO-220 POWER W/PINS BK |
EZKEY can provide 374324B00035G recommended part comparison data and engineering samples for evaluation.