22-01-3027 集管和线壳 HSG 2P W/RAMP/RIBS by Molex Inc

22-01-3027 | Molex Inc 集管和线壳 HSG 2P W/RAMP/RIBS

Name: 22-01-3027
Brand: Molex Inc
SKU: 22-01-3027

Category: Headers & Wire Housings

Brand: Molex Inc

集管和线壳 HSG 2P W/RAMP/RIBS

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Product Details

PDF Datasheet

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Description: 集管和线壳 HSG 2P W/RAMP/RIBS

Technical Parameters

Connector System	Wire-to-Board
Contact Finish	Tin
Contact Material	Copper Alloy
Current Rating	See datasheet
Flammability Rating	UL94V-0
Insulation Material	Nylon 66
Mounting Type	Through Hole
Number of Positions	See datasheet
Operating Temperature	-25 to +85 C
Pitch	3.96 mm
Product Type	Wire-to-Board Header
RoHS	Compliant
Series	KK 396 (3.96mm Pitch)
Voltage Rating	See datasheet

Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.

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PCB Footprint (.pcb)

3D Model (.stp)

Schematic Symbol (.sch)

DXF Drawing

22-01-3027 Application and Selection Guide

22-01-3027 Model and Manufacturer Information

22-01-3027, a Headers & Wire Housings manufactured by Molex Inc: 22-01-3027 helps you confirm the specific model, while Molex Inc helps you confirm the product source. If you are selecting a part, you can first check whether 22-01-3027 meets your requirements, then check whether Molex Inc matches your expectations, and then refer to 集管和线壳 HSG 2P W/RAMP/RIBS for further evaluation.

22-01-3027 Product Parameters and Description

The main parameters of Molex Inc's Headers & Wire Housings product 22-01-3027 include 集管和线壳 HSG 2P W/RAMP/RIBS. This is a Headers & Wire Housings produced by Molex Inc, and it also offers good applicability in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices.

22-01-3027 Application and Selection Reference

Molex Inc's Headers & Wire Housings product 22-01-3027 has a relatively wide range of applications in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices. Overall, 22-01-3027 is a Headers & Wire Housings solution worth considering, and manufacturer Molex Inc provides long-term supply program support for this product, which helps ensure supply continuity during mass production.

Recommended Part Numbers for 22-01-3027

Designers looking for 22-01-3027 recommended parts can evaluate the following options. 22-01-3027 selection decisions should verify parameters, tolerance and packaging against the original design bill of materials.

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EZKEY can provide 22-01-3027 recommended part comparison data and engineering samples for evaluation.