TDA8035HN/C2/S1EL HIGH INTEGRATED AND LOW POWER SM by NXP USA Inc.

TDA8035HN/C2/S1EL | NXP USA Inc. HIGH INTEGRATED AND LOW POWER SM

Category: General Purpose Semiconductors
Brand: NXP USA Inc.
HIGH INTEGRATED AND LOW POWER SM
Stock: On request
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Product Details

PDF Datasheet

Technical Docs

Description: HIGH INTEGRATED AND LOW POWER SM

Technical Parameters

ApplicationGeneral Purpose
BrandNXP USA Inc.
Data TierGeneral Description
Lead FreeYes
Mounting TypeSurface Mount
Operating Temperature-40 to +125 C
PackagingTape & Reel
Product TypeSemiconductor Component
RoHSCompliant
SeriesNXP
Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.
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