SIM-ST-MFF2 GLOBAL IOT EMBEDDED SIM CHIP by Hologram, Inc.

SIM-ST-MFF2 | Hologram, Inc. GLOBAL IOT EMBEDDED SIM CHIP

Category: General Purpose
Brand: Hologram, Inc.
GLOBAL IOT EMBEDDED SIM CHIP
Stock: On request

Product Details

PDF Datasheet

Technical Docs

Description: GLOBAL IOT EMBEDDED SIM CHIP

Technical Parameters

ApplicationGeneral Purpose
BrandHologram, Inc.
Data TierGeneral Description
ECCNEAR99
Halogen FreeYes
Lead FreeYes
PackagingTape & Reel
Product TypeElectronic Component
REACHCompliant
RoHSCompliant
Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.
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