QCC-3024-0-CSP90-TR-00-0 Qualcomm 40nm Single Chip BT 5.0 (BR, EDR, BLE) Audio Platform standalone embedded soln (no host proc); Aura - BT Audio SoC for Stereo Headsets; VFBGA90 by Qualcomm

QCC-3024-0-CSP90-TR-00-0 | Qualcomm Qualcomm 40nm Single Chip BT 5.0 (BR, EDR, BLE) Audio Platform standalone embedded soln (no host proc); Aura - BT Audio SoC for Stereo Headsets; VFBGA90

Category: Qualcomm
Brand: Qualcomm
Qualcomm 40nm Single Chip BT 5.0 (BR, EDR, BLE) Audio Platform standalone embedded soln (no host proc); Aura - BT Audio SoC for Stereo Headsets; VFBGA90
Stock: On request

Product Details

PDF Datasheet

Technical Docs

Description: Qualcomm 40nm Single Chip BT 5.0 (BR, EDR, BLE) Audio Platform standalone embedded soln (no host proc); Aura - BT Audio SoC for Stereo Headsets; VFBGA90

Technical Parameters

ApplicationGeneral Purpose
BrandQualcomm
CategoryQualcomm
Data TierGeneral Description
DescriptionQualcomm 40nm Single Chip BT 5.0 (BR, EDR, BLE) Audio Platform standalone embedded soln (no host proc); Aura - BT Audio SoC for Stereo Headsets; VFBGA90
ECCNEAR99
Halogen FreeYes
Lead FreeYes
ManufacturerRF360
PackagingTape & Reel
Product TypeElectronic Component
REACHCompliant
RoHSCompliant
Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.
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