MLG1005S33NJT Ind High Frequency Chip Unshielded Multi-Layer 33nH 5% 100MHz 8Q-Factor Ceramic 300mA 0402 T/R by TDK Corporation

MLG1005S33NJT | TDK Corporation Ind High Frequency Chip Unshielded Multi-Layer 33nH 5% 100MHz 8Q-Factor Ceramic 300mA 0402 T/R

Category: General Purpose
Brand: TDK Corporation
Ind High Frequency Chip Unshielded Multi-Layer 33nH 5% 100MHz 8Q-Factor Ceramic 300mA 0402 T/R
Stock: On request

Product Details

PDF Datasheet

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Description: Ind High Frequency Chip Unshielded Multi-Layer 33nH 5% 100MHz 8Q-Factor Ceramic 300mA 0402 T/R

Technical Parameters

ApplicationGeneral Purpose
BrandTDK Corporation
Data TierGeneral Description
Lead FreeYes
Mounting TypeSurface Mount
Operating Temperature-40 to +125 C
PackagingTape & Reel
Product TypeElectronic Component
RoHSCompliant
SeriesTDK
Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.
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