MIMX8UD7DVP08SC | NXP Semiconductors RF System on a Chip - SoC i.MX 8ULP: Arm Cortex-A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
Category:
General Purpose Semiconductors
Brand:
NXP Semiconductors
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex-A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
Stock:
On request
Product Details
PDF Datasheet
Technical Docs
Description: RF System on a Chip - SoC i.MX 8ULP: Arm Cortex-A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
Technical Parameters
| Application | General Purpose |
| Brand | NXP Semiconductors |
| Data Tier | General Description |
| Lead Free | Yes |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 to +125 C |
| Packaging | Tape & Reel |
| Product Type | Semiconductor Component |
| RoHS | Compliant |
| Series | NXP |
Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.
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