MF1S5030XDA4/V1J NFC/RFID标签和应答器 Mainstrm contactless smart card IC by NXP Semiconductors

MF1S5030XDA4/V1J | NXP Semiconductors NFC/RFID标签和应答器 Mainstrm contactless smart card IC

Category: General Purpose Semiconductors
Brand: NXP Semiconductors
NFC/RFID标签和应答器 Mainstrm contactless smart card IC
Stock: On request
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Product Details

PDF Datasheet

Technical Docs

Description: NFC/RFID标签和应答器 Mainstrm contactless smart card IC

Technical Parameters

ApplicationGeneral Purpose
BrandNXP Semiconductors
Data TierGeneral Description
Lead FreeYes
Mounting TypeSurface Mount
Operating Temperature-40 to +125 C
PackagingTape & Reel
Product TypeSemiconductor Component
RoHSCompliant
SeriesNXP
Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.
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