LM75BGD,125 温度传感器芯片, 数字式, ± 3°C, by NXP Semiconductors

LM75BGD,125 | NXP Semiconductors 温度传感器芯片, 数字式, ± 3°C,

Category: General Purpose Semiconductors
Brand: NXP Semiconductors
温度传感器芯片, 数字式, ± 3°C,
Stock: On request
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Product Details

PDF Datasheet

Technical Docs

Description: 温度传感器芯片, 数字式, ± 3°C,

Technical Parameters

ApplicationGeneral Purpose
BrandNXP Semiconductors
Data TierGeneral Description
Lead FreeYes
Mounting TypeSurface Mount
Operating Temperature-40 to +125 C
PackagingTape & Reel
Product TypeSemiconductor Component
RoHSCompliant
SeriesNXP
Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.
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