K4E8E324EB-EGCF DRAM Chip Mobile LPDDR3 SDRAM 8G-Bit 256M x 32 1.8V/1.2V 178-Pin FBGA - Trays by Samsung Electro-Mechanics

K4E8E324EB-EGCF | Samsung Electro-Mechanics DRAM Chip Mobile LPDDR3 SDRAM 8G-Bit 256M x 32 1.8V/1.2V 178-Pin FBGA - Trays

Category: General Purpose
Brand: Samsung Electro-Mechanics
DRAM Chip Mobile LPDDR3 SDRAM 8G-Bit 256M x 32 1.8V/1.2V 178-Pin FBGA - Trays
Stock: On request
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Product Details

PDF Datasheet

Technical Docs

Description: DRAM Chip Mobile LPDDR3 SDRAM 8G-Bit 256M x 32 1.8V/1.2V 178-Pin FBGA - Trays

Technical Parameters

ApplicationGeneral Purpose
BrandSamsung Electro-Mechanics
Data TierGeneral Description
ECCNEAR99
Halogen FreeYes
Lead FreeYes
PackagingTape & Reel
Product TypeElectronic Component
REACHCompliant
RoHSCompliant
Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.
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