DF23C-22DS-0.5 | Hirose

Name: DF23C-22DS-0.5
Brand: Hirose
SKU: DF23C-22DS-0.5

Category: Board to Board & Mezzanine Connectors

Brand: Hirose

Stock: On request

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Product Details

PDF Datasheet

Technical Docs

Description:

Technical Parameters

Applications	Wire-to-Board
Brand	Hirose
Contact Material	Copper Alloy
Contact Plating	Gold
Data Tier	Family Level
Features	General Purpose
Housing Material	Thermoplastic
Lead Free	Yes
Mounting Angle	Straight
Mounting Type	Surface Mount
Number of Rows	1
Operating Temperature	-40 to +85 C
Package / Case	SMD
Product Type	Board-to-Board Connector
RoHS	Compliant
Termination	Solder

Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.

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PCB Footprint (.pcb)

3D Model (.stp)

Schematic Symbol (.sch)

DXF Drawing

DF23C-22DS-0.5 Application and Selection Guide

DF23C-22DS-0.5 Model and Manufacturer Information

DF23C-22DS-0.5, a Board to Board & Mezzanine Connectors manufactured by Hirose: DF23C-22DS-0.5 helps you confirm the specific model, while Hirose helps you confirm the product source. If you are selecting a part, you can first check whether DF23C-22DS-0.5 meets your requirements, then check whether Hirose matches your expectations, and then refer to for further evaluation.

DF23C-22DS-0.5 Product Parameters and Description

The main parameters of Hirose's Board to Board & Mezzanine Connectors product DF23C-22DS-0.5 include . This is a Board to Board & Mezzanine Connectors produced by Hirose, and it also offers good applicability in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices.

DF23C-22DS-0.5 Application and Selection Reference

Hirose's Board to Board & Mezzanine Connectors product DF23C-22DS-0.5 has a relatively wide range of applications in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices. Overall, DF23C-22DS-0.5 is a Board to Board & Mezzanine Connectors solution worth considering, and manufacturer Hirose provides long-term supply program support for this product, which helps ensure supply continuity during mass production.

Recommended Part Numbers for DF23C-22DS-0.5

Designers looking for DF23C-22DS-0.5 recommended parts can evaluate the following options. DF23C-22DS-0.5 selection decisions should verify parameters, tolerance and packaging against the original design bill of materials.

Recommended Part	Brand	Description
FH62-21S-0.25SHW	Hirose	connector
FX8-100S-SV(22)	Hirose	Conn Board to Board RCP 100 POS 0.6mm Solder ST SMD T/R
FH35C-39S-0.3SHW(99）	Hirose

EZKEY can provide DF23C-22DS-0.5 recommended part comparison data and engineering samples for evaluation.