C9S08PA16AVTJR | NXP Semiconductors
Category:
Unspecified
Brand:
NXP Semiconductors
Stock:
On request
Product Details
PDF Datasheet
Technical Docs
Description:
Technical Parameters
| Applications | General Purpose |
| Data Tier | General Description |
| ESD Rating | 2 kV (HBM) |
| Features | General Purpose |
| Lead Free | Yes |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 to +85°C |
| Packaging | Tape & Reel |
| Product Type | Integrated Circuit |
| RoHS | Compliant |
| RoHS Status | RoHS Compliant |
| Series | NXP Semiconductors integrated circuit |
| Supply Voltage | 3.3 V |
Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.
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