C2012X7R1E335K(125AB) | TDK Corporation 多层陶瓷电容器MLCC - SMD/SMT 0805 25V 3.3uF X7R 10% T: 1.25mm
Brand:
TDK Corporation
多层陶瓷电容器MLCC - SMD/SMT 0805 25V 3.3uF X7R 10% T: 1.25mm
Stock:
On request
Product Details
PDF Datasheet
Technical Docs
Description: 多层陶瓷电容器MLCC - SMD/SMT 0805 25V 3.3uF X7R 10% T: 1.25mm
Technical Parameters
| Capacitance | 3.3 µF |
| Data Tier | Per-Part Decoded |
| Dielectric Characteristic | X7R |
| Features | Bypass and Decoupling |
| Mounting Type | Surface Mount |
| Operating Temperature | -55°C ~ +125°C |
| Operating Temperature Range | -55°C ~ +125°C |
| Package / Case | 0805 (2012 metric) |
| Packaging | Tape & Reel |
| Product Type | Multilayer Ceramic Capacitor |
| RoHS | Compliant |
| Standard | EIA / IEC MLCC |
| Temperature Coefficient / Cap Change | ±15% |
| Termination | Tin Plated Nickel Barrier |
| Tolerance | ±10% |
| Voltage Rating | 25V |
Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.
Datasheet not available online yet.
Can't find the datasheet you need? Contact our sourcing team and we'll help locate the official documentation from the manufacturer or our supply channels.
Request now →
