BGM113A256V2 蓝牙模块 - 802.15.1 BGM113 Wireless Bluetooth Module, PCB, +3 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, Built-in Antenna by Silicon Laboratories Inc

BGM113A256V2 | Silicon Laboratories Inc 蓝牙模块 - 802.15.1 BGM113 Wireless Bluetooth Module, PCB, +3 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, Built-in Antenna

Brand: Silicon Laboratories Inc
蓝牙模块 - 802.15.1 BGM113 Wireless Bluetooth Module, PCB, +3 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, Built-in Antenna
Stock: On request

Product Details

PDF Datasheet

Technical Docs

Description: 蓝牙模块 - 802.15.1 BGM113 Wireless Bluetooth Module, PCB, +3 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, Built-in Antenna

Technical Parameters

ApplicationRF Front-End
BrandSilicon Laboratories Inc
Data TierGeneral Description
Device TypeRF MOSFET / RFIC
FeatureStandard
Mounting TypeSMD
Operating Temperature-40 to +85 C
PackagingTape & Reel
RoHS CompliantYes
Supply Voltage3.3 V
TerminationTin-Plated
Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.
Datasheet not available online yet.
Can't find the datasheet you need? Contact our sourcing team and we'll help locate the official documentation from the manufacturer or our supply channels.
Request now →