BCM43569PKFFBG 通信集成电路 - 若干 Dual band MIMO (iPA) + BT by Cypress Semiconductor

BCM43569PKFFBG | Cypress Semiconductor 通信集成电路 - 若干 Dual band MIMO (iPA) + BT

Brand: Cypress Semiconductor
通信集成电路 - 若干 Dual band MIMO (iPA) + BT
Stock: On request

Product Details

PDF Datasheet

Technical Docs

Description: 通信集成电路 - 若干 Dual band MIMO (iPA) + BT

Technical Parameters

ApplicationNetworking / IoT / Automotive
Bluetooth IntegrationBluetooth 5.x
Data TierFamily Level
Device TypeWi-Fi / Bluetooth Combo Chip
FeaturesGeneral Purpose
Frequency Band2.4 GHz / 5 GHz dual band
Host InterfacesSDIO 3.0 / PCIe Gen2
InterfacesPCIe, USB, SDIO, UART, I2S, I2C
Mimo Configuration1x1 / 2x2 MIMO
Mounting StyleSurface Mount
Mounting TypeSurface Mount
Operating Temperature-40°C ~ +85°C
Package TypeBGA / WLCSP
Product TypeIntegrated Circuit
RoHSCompliant
Wi Fi Standard802.11 a/b/g/n/ac/ax
Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.
Datasheet not available online yet.
Can't find the datasheet you need? Contact our sourcing team and we'll help locate the official documentation from the manufacturer or our supply channels.
Request now →