BCM20737S | Broadcom Corporation RF System on a Chip - SoC WICED SMART BLE SIP w/ A4WP+security
Category:
Multiprotocol Processors
Brand:
Broadcom Corporation
RF System on a Chip - SoC WICED SMART BLE SIP w/ A4WP+security
Stock:
On request
Product Details
PDF Datasheet
Technical Docs
Description: RF System on a Chip - SoC WICED SMART BLE SIP w/ A4WP+security
Technical Parameters
| Application | IoT / Wearables / Audio |
| Applications | General Purpose |
| Bluetooth Version | Bluetooth 4.2 / 5.0 |
| Data Tier | Family Level |
| Device Type | Bluetooth SoC |
| Embedded Memory | 512 KB SRAM |
| Features | General Purpose |
| Interfaces | UART, SPI, I2C, PCM, I2S |
| Mounting Style | Surface Mount |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ +85°C |
| Package Type | WLCSP / BGA |
| Processor Core | ARM Cortex-M4 |
| Product Type | Integrated Circuit |
| RoHS | Compliant |
| Wireless Power Class | Class 2 / 3 |
Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.
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