BCM20733A2KML1G by Broadcom Corporation

BCM20733A2KML1G | Broadcom Corporation

Brand: Broadcom Corporation
Stock: On request

Product Details

PDF Datasheet

Technical Docs

Description:

Technical Parameters

ApplicationIoT / Wearables / Audio
ApplicationsGeneral Purpose
Bluetooth VersionBluetooth 4.2 / 5.0
Data TierFamily Level
Device TypeBluetooth SoC
Embedded Memory512 KB SRAM
FeaturesGeneral Purpose
InterfacesUART, SPI, I2C, PCM, I2S
Mounting StyleSurface Mount
Mounting TypeSurface Mount
Operating Temperature-40°C ~ +85°C
Package TypeWLCSP / BGA
Processor CoreARM Cortex-M4
Product TypeIntegrated Circuit
RoHSCompliant
Wireless Power ClassClass 2 / 3
Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.
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