B39162B4353P810 CSSP3 CU AE by Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)

B39162B4353P810 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) CSSP3 CU AE

Category: RF Modules
Brand: Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
CSSP3 CU AE
Stock: On request

Product Details

PDF Datasheet

Technical Docs

Description: CSSP3 CU AE

Technical Parameters

ApplicationCellular / RF front-end filtering
Component TypeSAW / BAW RF filter / duplexer
Data TierFamily Level
Impedance50 Ω
Lead FreeRoHS compliant
Mounting StyleSMD
Operating Temperature-30 °C to +85 °C
PackageSMD ceramic / laminate
Part FamilyTDK / RF360 B39xxx
TechnologySAW or BAW (FBAR)
Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.
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