B11B-XASK-1-A(LF SN) 2.5mm Pitch Disconnectable Crimp Style (Wire to Board by JST Sales America Inc

B11B-XASK-1-A(LF SN) | JST Sales America Inc 2.5mm Pitch Disconnectable Crimp Style (Wire to Board

Name: B11B-XASK-1-A(LF SN)
Brand: JST Sales America Inc
SKU: B11B-XASK-1-A(LF SN)

Category: Headers & Wire Housings

Brand: JST Sales America Inc

2.5mm Pitch Disconnectable Crimp Style (Wire to Board

Stock: On request

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Product Details

PDF Datasheet

Technical Docs

Description: 2.5mm Pitch Disconnectable Crimp Style (Wire to Board

Technical Parameters

Connector Type	Wire to Board Header
Contact Material	Copper Alloy
Contact Plating	Tin
Current Rating	3 A
Data Tier	Family Level
Housing Material	PA66 UL94V-0
Mounting Style	Through Hole
Mounting Type	Through Hole
Number of Positions	11
Number of Rows	1
Operating Temperature	-25 ~ +85 C
Pitch	2.50 mm
Product Type	Connector
RoHS	Compliant
Series	XASK
Voltage Rating	250 V

Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.

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PCB Footprint (.pcb)

3D Model (.stp)

Schematic Symbol (.sch)

DXF Drawing

B11B-XASK-1-A(LF SN) Application and Selection Guide

B11B-XASK-1-A(LF SN) Model and Manufacturer Information

B11B-XASK-1-A(LF SN), a Headers & Wire Housings manufactured by JST Sales America Inc: B11B-XASK-1-A(LF SN) helps you confirm the specific model, while JST Sales America Inc helps you confirm the product source. If you are selecting a part, you can first check whether B11B-XASK-1-A(LF SN) meets your requirements, then check whether JST Sales America Inc matches your expectations, and then refer to 2.5mm Pitch Disconnectable Crimp Style (Wire to Board for further evaluation.

B11B-XASK-1-A(LF SN) Product Parameters and Description

The main parameters of JST Sales America Inc's Headers & Wire Housings product B11B-XASK-1-A(LF SN) include 2.5mm Pitch Disconnectable Crimp Style (Wire to Board. This is a Headers & Wire Housings produced by JST Sales America Inc, and it also offers good applicability in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices.

B11B-XASK-1-A(LF SN) Application and Selection Reference

JST Sales America Inc's Headers & Wire Housings product B11B-XASK-1-A(LF SN) has a relatively wide range of applications in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices. Overall, B11B-XASK-1-A(LF SN) is a Headers & Wire Housings solution worth considering, and manufacturer JST Sales America Inc provides long-term supply program support for this product, which helps ensure supply continuity during mass production.

Recommended Part Numbers for B11B-XASK-1-A(LF SN)

Designers looking for B11B-XASK-1-A(LF SN) recommended parts can evaluate the following options. B11B-XASK-1-A(LF SN) selection decisions should verify parameters, tolerance and packaging against the original design bill of materials.

Recommended Part	Brand	Description
B2B-XH-A-E(LF)(SN)(P)	JST Sales America Inc	Top Entry 2 Circuit, Blue colour Through Hole Shrouded Header
B3B-XH-A-R(LF)(SN)	JST Sales America Inc	HEADER TOP B3B-XH-A-R红(LF SN)
B4B-ZR-3.4-R	JST Sales America Inc	连接器

EZKEY can provide B11B-XASK-1-A(LF SN) recommended part comparison data and engineering samples for evaluation.