AR9350-DC3B QCA9350D CHIPSET 2X2 DB AP-SOC CPU + MII/RMII/RGMII/PCIE/USB + 2X2 DB WLAN, x32 DRAM, NAND, Enterprise Version (Cu) I-TEMP by Qualcomm

AR9350-DC3B | Qualcomm QCA9350D CHIPSET 2X2 DB AP-SOC CPU + MII/RMII/RGMII/PCIE/USB + 2X2 DB WLAN, x32 DRAM, NAND, Enterprise Version (Cu) I-TEMP

Category: Specialized ICs
Brand: Qualcomm
QCA9350D CHIPSET 2X2 DB AP-SOC CPU + MII/RMII/RGMII/PCIE/USB + 2X2 DB WLAN, x32 DRAM, NAND, Enterprise Version (Cu) I-TEMP
Stock: On request

Product Details

PDF Datasheet

Technical Docs

Description: QCA9350D CHIPSET 2X2 DB AP-SOC CPU + MII/RMII/RGMII/PCIE/USB + 2X2 DB WLAN, x32 DRAM, NAND, Enterprise Version (Cu) I-TEMP

Technical Parameters

BrandQualcomm
Data TierFamily Level
Operating Temperature-40 to +85 C
Product TypeIC
RoHSCompliant
Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.
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