AR9331 | Qualcomm Technology 集成MIPS 24Kc内核，最高主频400MHz 支持16 bit DDR1，DDR2，SDRAM 支持SPI Flash 集成1个五端口百兆以太网交换机 集成完整射频前端 支持分集接收 支持高速串口，可达3Mbps 支持I2S/S-PDIF接口 具有USB 2.0 Host/Device 接口 具有GPIO 148脚，双排LPCC封装
Category:
Specialized ICs
Brand:
Qualcomm Technology
集成MIPS 24Kc内核，最高主频400MHz
支持16 bit DDR1，DDR2，SDRAM
支持SPI Flash
集成1个五端口百兆以太网交换机
集成完整射频前端
支持分集接收
支持高速串口，可达3Mbps
支持I2S/S-PDIF接口
具有USB 2.0 Host/Device 接口
具有GPIO
148脚，双排LPCC封装
Stock:
On request
Product Details
PDF Datasheet
Technical Docs
Description: 集成MIPS 24Kc内核，最高主频400MHz 支持16 bit DDR1，DDR2，SDRAM 支持SPI Flash 集成1个五端口百兆以太网交换机 集成完整射频前端 支持分集接收 支持高速串口，可达3Mbps 支持I2S/S-PDIF接口 具有USB 2.0 Host/Device 接口 具有GPIO 148脚，双排LPCC封装
Technical Parameters
| Brand | Qualcomm Technology |
| Data Tier | Family Level |
| Operating Temperature | -40 to +85 C |
| Product Type | IC |
| RoHS | Compliant |
Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.
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