44769-0602 | Molex Inc Conn Wire to Board RCP 6 POS 3mm Solder ST Thru-Hole Micro-Fit 3.0 BMI™ Tray
Category:
Rectangular Connectors
Brand:
Molex Inc
Conn Wire to Board RCP 6 POS 3mm Solder ST Thru-Hole Micro-Fit 3.0 BMI™ Tray
Stock:
On request
Product Details
PDF Datasheet
Technical Docs
Description: Conn Wire to Board RCP 6 POS 3mm Solder ST Thru-Hole Micro-Fit 3.0 BMI™ Tray
Technical Parameters
| Contact Finish | Tin / Gold |
| Contact Material | Copper Alloy |
| Data Tier | Family Level |
| Flammability Rating | UL94V-0 |
| Insulation Material | Thermoplastic / Nylon |
| Mounting Type | Through Hole / SMD |
| Operating Temperature | -40 to +105 C |
| Product Type | Wire-to-Board / Board-to-Board Connector |
| RoHS | Compliant |
| Series | Molex Connector |
Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.
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