44764-1602 Conn Wire to Board RCP 16 POS 3mm Solder RA Thru-Hole Micro-Fit 3.0 BMI™ Tray by Molex Inc

44764-1602 | Molex Inc Conn Wire to Board RCP 16 POS 3mm Solder RA Thru-Hole Micro-Fit 3.0 BMI™ Tray

Category: Rectangular Connectors
Brand: Molex Inc
Conn Wire to Board RCP 16 POS 3mm Solder RA Thru-Hole Micro-Fit 3.0 BMI™ Tray
Stock: On request
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Product Details

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Technical Docs

Description: Conn Wire to Board RCP 16 POS 3mm Solder RA Thru-Hole Micro-Fit 3.0 BMI™ Tray

Technical Parameters

Contact FinishTin / Gold
Contact MaterialCopper Alloy
Data TierFamily Level
Flammability RatingUL94V-0
Insulation MaterialThermoplastic / Nylon
Mounting TypeThrough Hole / SMD
Operating Temperature-40 to +105 C
Product TypeWire-to-Board / Board-to-Board Connector
RoHSCompliant
SeriesMolex Connector
Standard Packaging: Standard packaging refers to the minimum packaging quantity obtained from the manufacturer/distributor. Therefore, the minimum order quantity may be less than the manufacturer's standard packaging quantity. When products are broken down into smaller quantities, the packaging type (i.e., reel, tube, tray) may change, subject to actual packaging delivery.
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