22-11-1061 Application and Selection Guide
22-11-1061 Model and Manufacturer Information
22-11-1061, a Headers & Wire Housings manufactured by Molex Inc: 22-11-1061 helps you confirm the specific model, while Molex Inc helps you confirm the product source. If you are selecting a part, you can first check whether 22-11-1061 meets your requirements, then check whether Molex Inc matches your expectations, and then refer to 2.50mm Pitch KK® Wire-to-Board Header, Vertical, with Friction Ramp, 6 Circuits, Gold (Au) Plating for further evaluation.
22-11-1061 Product Parameters and Description
The main parameters of Molex Inc's Headers & Wire Housings product 22-11-1061 include 2.50mm Pitch KK® Wire-to-Board Header, Vertical, with Friction Ramp, 6 Circuits, Gold (Au) Plating. This is a Headers & Wire Housings produced by Molex Inc, and it also offers good applicability in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices.
22-11-1061 Application and Selection Reference
Molex Inc's Headers & Wire Housings product 22-11-1061 has a relatively wide range of applications in embedded systems, common 3C electronics, automotive electronics, electronic devices, and IoT devices. Overall, 22-11-1061 is a Headers & Wire Housings solution worth considering, and manufacturer Molex Inc provides long-term supply program support for this product, which helps ensure supply continuity during mass production.
Recommended Part Numbers for 22-11-1061
Designers looking for 22-11-1061 recommended parts can evaluate the following options. 22-11-1061 selection decisions should verify parameters, tolerance and packaging against the original design bill of materials.
| Recommended Part |
Brand |
Package |
Description |
| 22-28-4033 |
Molex Inc |
|
Conn Unshrouded Header HDR 3 POS 2.54mm Solder ST Thru-Hole KK? Bag |
| 22-11-1021 |
Molex Inc |
|
Conn Wire to Board HDR 2 POS 2.5mm Solder ST Thru-Hole KK® Bag |
| 22052091 |
Molex Inc |
|
CONN HEADER 9POS .100 R/A TIN |
EZKEY can provide 22-11-1061 recommended part comparison data and engineering samples for evaluation.